PACK EXPO International 2026 Sets Stage for Packaging Automation and Workforce

Exhibitions & New Products 2026-10-08 Source: PMMI

PMMI has announced that PACK EXPO International 2026 will run from 18 to 21 October at McCormick Place in Chicago, bringing together more than 2,700 exhibitors across 1.3 million square feet of exhibition space and about 48,000 attendees from over 40 vertical markets. Organisers highlighted automation, robotics, AI and sustainability as core themes, alongside new programmes aimed at small and medium-sized businesses. The show will also feature student engineering competitions and a workforce development pavilion intended to ease the industry’s skilled-labour shortage.

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This is an editorial summary written by Xinray Technology. All rights to the original report belong to PMMI.

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